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    <title>3D Packaging on KAD</title>
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      <title>Huawei’s τ Law: Rethinking Chip Scaling Beyond Moore’s Law</title>
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&lt;p&gt;Huawei’s τ Law: Rethinking Chip Scaling Beyond Moore’s Law&lt;/p&gt;&lt;/blockquote&gt;
&lt;p&gt;As Moore’s Law approaches both physical and economic limits, the semiconductor industry is being forced to rethink how computing performance can continue scaling in the coming decade. At the IEEE ISCAS conference in Shanghai, Huawei revealed a major shift in its semiconductor research strategy: moving away from traditional geometric scaling and toward what it calls &lt;strong&gt;temporal compression&lt;/strong&gt;.&lt;/p&gt;</description>
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      <title>AMD Overlap Stacking: Breaking the Reticle Limit in 2026</title>
      <link>https://www.kad8.com/hardware/amd-overlap-stacking-breaking-the-reticle-limit-in-2026/</link>
      <pubDate>Mon, 20 Apr 2026 23:13:56 +0800</pubDate>
      
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&lt;p&gt;AMD Overlap Stacking: Breaking the Reticle Limit in 2026&lt;/p&gt;&lt;/blockquote&gt;
&lt;p&gt;As of &lt;strong&gt;April 20, 2026&lt;/strong&gt;, AMD’s &lt;strong&gt;“Overlap” stacking patent&lt;/strong&gt;—first revealed in late 2024—has evolved into a foundational technology of its &lt;strong&gt;Extreme Modular architecture&lt;/strong&gt; strategy.&lt;/p&gt;</description>
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