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      <title>Samsung and SK hynix Delay Hybrid Bonding for HBM4 as Memory Roadmaps Shift</title>
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      <pubDate>Tue, 07 Jul 2026 18:25:32 +0800</pubDate>
      
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&lt;p&gt;Samsung and SK hynix Delay Hybrid Bonding for HBM4 as Memory Roadmaps Shift&lt;/p&gt;&lt;/blockquote&gt;
&lt;p&gt;Hybrid bonding, long expected to become one of the defining technologies of the HBM4 generation, is reportedly being pushed further down the roadmap by both Samsung and SK hynix. Instead of debuting with HBM4, the advanced packaging technology is now expected to arrive with later generations such as HBM4E or HBM5E.&lt;/p&gt;</description>
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