Silicon Photonics on KAD

TSMC vs Intel vs Samsung vs GF: The CPO Roadmap Race

Sat, 15 Aug 2026 15:28:10 +0800

TSMC vs Intel vs Samsung vs GF: The CPO Roadmap Race

Co-Packaged Optics (CPO) is moving from research demonstrations toward commercial AI infrastructure. On August 3, 2026, NVIDIA began shipping its Spectrum-X CPO switches to selected partners, while Broadcom continued small-batch deliveries of its 51.2T Bailly CPO switches.

Why Optical Module MCUs Are Becoming Critical for AI Data Centers

Mon, 29 Jun 2026 22:03:52 +0800

Why Optical Module MCUs Are Becoming Critical for AI Data Centers

The explosive growth of AI infrastructure is reshaping every layer of the data center hardware stack. While GPUs, networking ASICs, and optical transceivers receive much of the attention, another component has quietly become indispensable—the optical module Microcontroller Unit (MCU).

The Future of Optical Communication: From Fiber to CPO

Sat, 13 Jun 2026 01:03:17 +0800

The Future of Optical Communication: From Fiber to CPO

The explosive growth of artificial intelligence has transformed optical communication from a niche infrastructure technology into one of the most strategically important sectors in modern computing. As AI clusters scale from thousands to potentially millions of interconnected accelerators, demand for bandwidth, energy efficiency, and low-latency communication continues to rise at an unprecedented pace.

LPO vs CPO vs NPO: The Future of AI Optical Interconnects

Fri, 12 Jun 2026 22:04:59 +0800

LPO vs CPO vs NPO: The Future of AI Optical Interconnects

The rapid expansion of artificial intelligence and high-performance computing (HPC) infrastructure is pushing network architectures toward unprecedented levels of scale. Modern AI clusters now connect tens of thousands of accelerators, while networking bandwidth requirements are moving from 800G to 1.6T and eventually 3.2T per port.

Why Marvell Could Be the Biggest Winner in the CPO Era

Thu, 11 Jun 2026 22:47:07 +0800

Why Marvell Could Be the Biggest Winner in the CPO Era

As artificial intelligence clusters continue to scale from thousands to potentially millions of interconnected accelerators, the data center industry is rapidly approaching the physical limits of traditional networking technologies. This transition is driving growing interest in Co-Packaged Optics (CPO), a technology widely viewed as a key enabler of next-generation AI infrastructure.

CPO vs LPO: Which Optical Interconnect Technology Will Shape AI Data Centers?

Thu, 04 Jun 2026 23:02:32 +0800

CPO vs LPO: Which Optical Interconnect Technology Will Shape AI Data Centers?

The rapid growth of artificial intelligence, cloud computing, and high-performance computing (HPC) is pushing data center networking beyond the limits of traditional optical interconnect architectures. As bandwidth requirements move from 400G to 800G and eventually 1.6T and beyond, power consumption, signal integrity, thermal management, and packaging complexity have become critical bottlenecks.

Can Marvell Become the Next Broadcom in the AI Semiconductor Era?

Wed, 03 Jun 2026 23:50:56 +0800

Can Marvell Become the Next Broadcom in the AI Semiconductor Era?

The AI semiconductor industry is entering a new phase. While NVIDIA continues to dominate the GPU market, the next wave of value creation is increasingly shifting toward the infrastructure layers that enable large-scale AI deployments. Custom accelerators, optical interconnects, networking silicon, and advanced packaging technologies are becoming critical components of modern AI data centers.

Why NVIDIA Sees Co-Packaged Optics as the Future of AI Networking

Wed, 03 Jun 2026 00:29:29 +0800

Why NVIDIA Sees Co-Packaged Optics as the Future of AI Networking

As AI infrastructure scales toward clusters containing hundreds of thousands—or eventually millions—of accelerators, networking is rapidly becoming the industry’s most critical bottleneck. While GPUs remain the centerpiece of AI computing, the ability to move data efficiently between those processors increasingly determines overall system performance.

AMD MI500: Optical Interconnects Redefine AI Scaling

Tue, 21 Apr 2026 18:03:28 +0800

AMD MI500: Optical Interconnects Redefine AI Scaling

As of April 21, 2026, the strategic alignment between Advanced Micro Devices (AMD) and GlobalFoundries for the Instinct MI500 signals a fundamental shift in AI system design. By integrating Co-Packaged Optics (CPO), AMD is no longer optimizing purely for compute density—it is optimizing for system-wide data movement efficiency.