<?xml version="1.0" encoding="utf-8" standalone="yes"?>
<rss version="2.0" xmlns:atom="http://www.w3.org/2005/Atom">
  <channel>
    <title>STCO on KAD</title>
    <link>https://www.kad8.com/tags/stco/</link>
    <description>Recent content in STCO on KAD</description>
    <generator>Hugo -- gohugo.io</generator>
    <language>en</language>
    <copyright>© 2026 </copyright>
    <lastBuildDate>Sat, 05 Sep 2026 18:38:56 +0800</lastBuildDate><atom:link href="https://www.kad8.com/tags/stco/index.xml" rel="self" type="application/rss+xml" />
    <item>
      <title>Huawei Tau Scaling: How LogicFolding Targets Chip Power and Heat</title>
      <link>https://www.kad8.com/hardware/huawei-tau-scaling-how-logicfolding-targets-chip-power-and-heat/</link>
      <pubDate>Sat, 05 Sep 2026 18:38:56 +0800</pubDate>
      
      <guid>https://www.kad8.com/hardware/huawei-tau-scaling-how-logicfolding-targets-chip-power-and-heat/</guid>
      <description>&lt;blockquote&gt;
&lt;p&gt;Huawei Tau Scaling: How LogicFolding Targets Chip Power and Heat&lt;/p&gt;&lt;/blockquote&gt;
&lt;p&gt;Huawei semiconductor executive He Tingbo has published a new paper addressing one of the most obvious challenges surrounding the company&amp;rsquo;s proposed &lt;strong&gt;Tau (τ) scaling law&lt;/strong&gt;: thermal management.&lt;/p&gt;</description>
      <media:content xmlns:media="http://search.yahoo.com/mrss/" url="https://www.kad8.com/hardware/huawei-tau-scaling-how-logicfolding-targets-chip-power-and-heat/featured-Transistors_folding_in_architecture.jpeg" />
    </item>
    
  </channel>
</rss>
