Intel Poised to Capture Google TPU Packaging Orders, Rumors Suggest #
Rumors surrounding Intel’s advanced packaging capabilities have intensified, with new industry reports indicating that Intel could secure packaging orders for Google’s future TPU designs, potentially including the TPU v9 expected around 2027. In parallel, Meta is said to be evaluating Intel’s packaging technologies for its MTIA (Meta Training & Inference Accelerator) program. These developments signal growing interest in Intel Foundry Services (IFS) as US customers look for alternative supply chain options.
Intel’s US Packaging Capacity Becomes a Strategic Advantage #
With the United States still facing a shortage of advanced packaging capacity, companies seeking geographically diverse suppliers are increasingly eyeing providers with available and scalable manufacturing resources.
Intel’s EMIB (Embedded Multi-die Interconnect Bridge) and Foveros technologies—already deployed in high-volume products—are seen as viable alternatives in scenarios where TSMC’s CoWoS remains constrained.
According to TrendForce, since Intel established IFS in 2021, the company has aggressively expanded EMIB deployment, supporting large-scale server processors such as:
- Sapphire Rapids
- Granite Rapids
These processors rely heavily on multi-chiplet packaging and dense interconnects, enabling Intel to build real-world experience in packaging reliability and yield.
Why Google and Meta Are Taking Notice #
Industry sources say Google’s potential adoption of EMIB for future TPUs reflects growing confidence in Intel’s packaging capabilities. Google’s TPU family traditionally relies on TSMC CoWoS for high-bandwidth interconnects essential to training and inference throughput.
However, with CoWoS capacity remaining tight and demand from AI accelerator vendors surging, cloud providers are exploring multi-vendor strategies.
Meta’s evaluation of EMIB for its next-generation MTIA chips reinforces this trend, showing that AI accelerators—beyond GPUs—are adopting broader packaging strategies. Intel’s US-based manufacturing footprint further strengthens its appeal for companies prioritizing:
- Supply chain security
- Delivery reliability
- Domestic production options
CoWoS Dominance Continues, but EMIB Offers Design Flexibility #
While TSMC’s CoWoS still dominates AI and HPC packaging, especially in NVIDIA and AMD product lines, EMIB brings notable advantages:
Key EMIB Strengths #
- More flexible cost structure
- Easier capacity scheduling
- Modular chiplet integration
- Reduced packaging requirements for certain process nodes
These characteristics can help companies optimize ASIC design cycles and potentially reduce production bottlenecks. AWS and MediaTek have already adopted EMIB in select products, providing additional validation for its deployment.
Beyond EMIB: Intel’s 3D Packaging Roadmap #
Intel’s advanced packaging strategy extends well beyond EMIB. Its Foveros and Foveros Direct technologies enable:
- Higher vertical interconnect density
- Lower resistance and improved power characteristics
- More efficient 3D stacking
As high-performance processors increasingly shift toward multi-chip and stacked architectures, advanced packaging is no longer optional—it’s now a core performance determinant.
Interest from accelerator vendors in Foveros Direct 3D suggests further momentum toward highly integrated chiplet and 3D-stacked designs.
A More Diversified Packaging Landscape Is Emerging #
Even if Intel wins more external customers, this shift does not threaten TSMC’s leadership in CoWoS. Instead, the industry is steadily moving toward a multi-vendor, multi-node ecosystem, driven by:
- The need for stable supply chains
- The growth of custom AI accelerators
- Surging demand in training and inference workloads
This diversification helps relieve global packaging bottlenecks and gives large chip designers more flexibility as they plan next-generation architectures.
Outlook: Intel Becomes a Serious Contender in Advanced Packaging #
As global AI demand accelerates and custom ASICs proliferate, packaging competition is evolving from purely technical differentiation to a combination of:
- Technical capability
- Capacity availability
- Geographic diversification
Intel’s US-based infrastructure and proven packaging experience position it as a credible alternative for major customers evaluating future supply chain strategies. The choices made by companies like Google and Meta in the coming years could reshape both the competitive landscape and the supply chain dynamics of the entire high-performance computing market.