At the CES 2026 NVIDIA Special Keynote, Jensen Huang officially introduced AI solutions for the Vera Rubin platform. With this generational shift, GPU power consumption has surged dramatically—from 1400W (Blackwell Ultra) to 1950W for Rubin, forcing a fundamental rethink of data center power delivery and thermal design.
And this is only the beginning. Industry projections indicate:
- Rubin Ultra approaching 3600W by 2027
- The Feynman-generation GPU reaching an unprecedented 4400W by 2029
Against this backdrop of accelerating power density, Frore Systems emerged at CES 2026 with a purpose-built solution for extreme thermal loads: LiquidJet.
💧 LiquidJet: Redefining the Thermal Ceiling #
LiquidJet is a next-generation liquid cooling cold plate designed to replace conventional data center cold plates. Manufactured using precision wafer-level processes, it employs a multistage 3D short-loop jet-channel microfluidic structure optimized for ultra-high heat flux.
Key innovations include:
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Extreme Power Headroom
Engineered to cool GPUs exceeding 4400W, making today’s 1950W Rubin accelerators comparatively easy to manage. -
Hotspot-Aware Cooling
Instead of uniform heat spreading, LiquidJet aligns internal jet channels precisely with GPU thermal hotspots, enabling highly targeted heat extraction. -
Dramatic Efficiency Gains
LiquidJet reduces GPU junction temperatures by up to 7.7°C while allowing inlet water temperatures to rise from 25°C to 40°C.
This increases the system COP from 4.5 to 7, translating into a 30–35% reduction in total cooling-related electricity consumption.
In an era where cooling overhead directly impacts data center economics, these gains are transformative.
🌐 From Hyperscale to the Edge #
While LiquidJet targets cloud-scale deployments, Frore Systems is simultaneously addressing Edge AI and mobile platforms through its solid-state cooling technology: AirJet.
🔹 AirJet PAK 5C-G2 #
Demonstrated cooling the NVIDIA Jetson Orin NX Super (up to 185 TOPS), the AirJet PAK 5C-G2 integrates five AirJet Mini G2 modules into a single compact assembly.
- Cooling Capacity: 45W net active cooling, compared to ~20W passive
- Form Factor: Credit-card-sized, approximately 1 cm thick
- Reliability: 27 dBA noise, zero vibration, and IP65-rated dust and water resistance
This enables sustained high-performance edge AI in sealed, rugged environments.
🔹 AirJet Mini G2 for Consumer Devices #
Individual AirJet Mini G2 modules deliver 7.5W of cooling and are already being integrated into mini PCs, tablets, and waterproof imaging devices.
By generating up to 1750 Pa of back pressure, these MEMS-based coolers can expel heat through gaps as small as 1 mm, enabling truly fanless, fully sealed designs without thermal compromise.
🔮 Cooling as a Commodity #
Frore Systems’ long-term vision is to make advanced cooling as standardized and accessible as passive electronic components.
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Manufacturing Scale (2026):
- 5 million AirJet chips
- 500,000 LiquidJet cold plates
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Plug-and-Play Integration
OEMs can integrate LiquidJet or AirJet by simply adding a part number to the BOM, eliminating custom molds, fans, or complex mechanical redesigns.
As AI accelerators push beyond 4 kW per device, cooling is no longer a secondary concern—it is a defining system constraint. With microfluidic precision cooling (LiquidJet) and solid-state MEMS airflow (AirJet), Frore Systems is positioning thermal management as a first-class, scalable infrastructure component for the AI era.