Loongson is accelerating the development of its next-generation server processor, known as the 3D7000 series, which will feature over 32 cores per chiplet, a new underlying IP architecture, and an updated 10nm-class manufacturing process. The company is targeting a 2027 launch window, positioning the chip to compete with global CPU roadmaps from major vendors.
A Major Step Beyond Current Loongson Platforms #
Today, Loongson’s server lineup includes the 3C6000 and 3D5000 families:
- 3C6000: A 12nm processor with 16 cores per chiplet, scaling up to 64 cores in a multi-chip package (TDP 300W).
- 3D5000: A workstation-focused processor offering 32 cores at 2.0GHz.
The upcoming 3D7000 series marks a substantial architectural leap. With more than 32 cores within a single chiplet, Loongson is effectively doubling the core density relative to its existing designs. This shift indicates newly designed compute clusters, updated internal interconnects, and revised power/thermal strategies.
New IP Foundation for a More Advanced Node #
Loongson has confirmed that development has begun on a full suite of custom IP targeting its next manufacturing node. Key modules include:
- PLL (Phase-Locked Loop)
- Multi-port register file
- DDR5-PHY
- PCIe 5.0 PHY
The 3D7000 platform will fully support DDR5 memory and PCIe 5.0, aligning with the bandwidth capabilities of current and upcoming global server-class processors. The move to a sub-10nm node is expected to deliver:
- Higher achievable clock speeds
- Lower power density
- Greater headroom for increasing core counts
- Improved I/O and memory throughput
Competitive Timing With Global CPU Roadmaps #
The projected 2027 launch places the 3D7000 in the same generation as several international products. For example, AMD’s Zen 6 server roadmap includes both traditional CCDs and high-density CCDs targeting the 2026–2027 time frame.
Assuming Loongson maintains its schedule, volume adoption could begin in 2028, coinciding with global refresh cycles in cloud infrastructure and enterprise data centers.
Loongson’s First Consumer GPU: 9A1000 #
In parallel, Loongson is preparing its first standalone GPU, the 9A1000, targeting the AI-PC and general-purpose desktop acceleration market. The chip has reportedly completed tape-out, with Windows driver development underway. The introduction of a discrete GPU suggests Loongson is working toward a more complete ecosystem, spanning CPUs, GPUs, and system-level software support.
Outlook for the 3D7000 Series #
Although detailed SKUs, clock frequencies, and architecture diagrams remain undisclosed, early information points to three major upgrade vectors:
- Higher core density
- More advanced I/O bandwidth (DDR5 & PCIe 5.0)
- Improved process technology
If delivered as planned, the 3D7000 will represent one of Loongson’s most ambitious server-class CPU updates to date, aimed at strengthening its position in global data center and enterprise markets.