The United States is accelerating efforts to build a complete domestic semiconductor ecosystem covering R&D, manufacturing, and advanced packaging. Although TSMC’s Arizona fabs are progressing, the region still lacks sufficient advanced packaging capacity. In contrast, Intel currently offers the most comprehensive onshore packaging capabilities, including high-density production lines and mature 2.5D/3D technologies such as EMIB and Foveros.
As a result, several U.S. technology companies—Microsoft, Tesla, Qualcomm, and NVIDIA—are reportedly engaging with Intel for packaging cooperation linked to their Arizona chip programs.
Why U.S. Fabless Companies Are Turning to Intel #
Most U.S. customers using TSMC’s Arizona fabs still follow a model of:
Chip fabrication in Arizona → wafers shipped to Taiwan → advanced packaging → shipped back to the U.S.
This cross-border flow introduces:
- Long logistics lead times
- Higher transportation costs
- Delays in mass-production schedules
If advanced packaging can be completed inside the U.S., production efficiency improves and product rollout cycles shorten. For this reason, more companies are exploring a “TSMC manufacturing + Intel packaging” model. This gives Intel Foundry Services (IFS) a valuable near-term opportunity to expand its packaging business and revenue.
Intel Strengthens Packaging Expertise #
To reinforce this strategic direction, Intel has hired several experts experienced in the TSMC ecosystem, including Dr. Lo Wei-Jen, formerly responsible for CoWoS and advanced packaging at TSMC.
His familiarity with U.S. customers and supply-chain challenges helps Intel fine-tune its packaging roadmap to meet increasing demands for:
- Higher bandwidth
- Denser interconnects
- System-level integration
As Intel’s Arizona capacity ramps up, companies such as NVIDIA, AMD, and even Apple may adopt Intel’s domestic packaging lines, potentially eliminating the need to ship wafers back to Asia.
Qualcomm and Apple Prepare Multi-Path Packaging Strategies #
Both Qualcomm and Apple have been hiring engineers with experience in Intel technologies such as EMIB and Foveros. This reflects broader industry planning for:
- Multiple packaging pathways
- Greater flexibility in supply chain security
- The rising complexity of NPU, GPU, and heterogeneous computing chips
This talent reserve suggests long-term strategic diversification rather than short-term experimentation.
TSMC’s U.S. Packaging Is Coming — But Will Take Time #
TSMC is also building local advanced packaging capacity in the United States. However, the setup process is lengthy, requiring:
- Installation and calibration of advanced packaging equipment
- Development of specialized workforce
- Multi-year verification cycles for the entire production line
In the near term, companies like Intel and Amkor will serve as critical partners, helping support TSMC’s U.S. customers and maintain supply-chain continuity.
A Potential Future: Complementary U.S. Ecosystem #
Looking ahead, a cooperative model may gradually form:
- TSMC: advanced process manufacturing
- Intel: system-level packaging capabilities
Rather than direct competition, this creates a complementary U.S. semiconductor structure, supporting:
- A full local manufacturing loop in the U.S.
- More business visibility and orders for IFS
- Increased resilience in the domestic chip supply chain
Intel’s Growing Role in the U.S. Packaging Landscape #
As Arizona production expands, U.S. customers’ demand for local advanced packaging will continue to rise. With deep experience in U.S.-based packaging technologies, Intel is positioned at the center of this shift.
From short-term service provider to long-term ecosystem partner, Intel’s packaging business is evolving into an open, strategic industry service, and its influence within the U.S. semiconductor system is expected to grow significantly.