A new AMD mobile processor—Ryzen AI 9 HX 470, part of the upcoming Gorgon Point lineup—has surfaced in the SiSoftware Ranker database, marking its transition into real-world testing at OEM partners. The appearance provides early insight into the specifications and positioning of AMD’s next-generation Ryzen AI 400 series.
Zen 5 Refresh With Modest Performance Gains #
According to the benchmark entry, the Ryzen AI 9 HX 470 continues to use the Zen 5 CPU architecture and RDNA 3.5 integrated graphics, making it an incremental generational update rather than a full redesign.
The engineering sample tested inside an HP EliteBook X G2a 14-inch laptop features:
- 12 cores / 24 threads
- 2.0 GHz base frequency
- ~5.25 GHz max boost (slightly higher than the HX 370’s 5.1 GHz)
- 2,096.51 Mpix/s multimedia score in SiSoftware
This score places the chip in the upper-mid range of current mobile processors, though as an engineering sample, clock speeds and power behavior are expected to change before retail launch.
RDNA 3.5 GPU and XDNA 2 NPU Integration #
The entry confirms the use of the Radeon 890M iGPU based on RDNA 3.5, matching earlier leaks. While GPU frequency numbers were not included, the HX 470 is expected to maintain a high compute unit count with small clock or power adjustments to differentiate it from Strix Point-based products.
The processor also integrates XDNA 2, AMD’s next-generation NPU architecture, offering improved local AI inference performance. Compute throughput is expected to land slightly above current Ryzen AI 300-series designs, strengthening AMD’s AI PC portfolio.
Cache Configuration Still Unconfirmed #
One of the most discussed rumors is an increase in L3 cache capacity, with some sources suggesting a configuration of 3 × 16 MB for high-end SKUs. This detail does not appear in the current leak, leaving final cache layout uncertain until official specifications are published.
Positioned as the Next Step in AMD’s Mobile Roadmap #
The Ryzen AI 9 HX 470 will top the Ryzen AI 400 series, which succeeds the current Strix Point and Krackan Point families. Earlier manufacturing data shows that the series may span:
- 4c/8t to 12c/24t configurations
- Ryzen AI 3, 5, 7, and 9 tiers
- Coverage ranging from mainstream business laptops to high-performance ultraportables
The use of the same FP8 package, similar TDP ranges, and compatible motherboard layouts means OEMs can adopt Gorgon Point with minimal redesign, accelerating deployment for 2025 laptops.
Early OEM Testing Indicates Imminent Launch #
The benchmark entry, captured on a Windows 11 x64 system running on HP’s business-focused EliteBook platform, confirms that evaluation units are already in the hands of manufacturers. This suggests that the Gorgon Point series has entered the system validation phase, an important milestone before mass production.
A Mid-Cycle Refresh Focused on Efficiency and AI #
The HX 470 and broader Gorgon Point lineup maintain the Zen 5 + RDNA 3.5 + XDNA 2 architecture, targeting incremental improvements:
- Slightly higher CPU and GPU clocks
- Potential L3 cache expansion
- Improved NPU compute power
- Maintained core counts and process technology
For end users, the performance uplift is expected to be modest, aimed more at refinement and efficiency than dramatic generational leaps.
Awaiting AMD’s Official Announcement #
All current information is based on third-party database leaks and internal shipment references. AMD has yet to formally disclose:
- Final frequencies
- Cache configuration
- Power envelopes
- Launch timing
However, the appearance of the Ryzen AI 9 HX 470 in OEM hardware strongly indicates the Ryzen AI 400 series is approaching its official unveiling, with next-gen laptops likely to arrive soon.