Hardwares
2026
AMD Zen 6 Roadmap: Ultra-Low Power Cores, 2nm CPUs, and Memory-on-Package
·1231 words·6 mins
AMD
Zen 6
CPU
Semiconductor
Tsmc
Threadripper
Ryzen
Embedded Systems
AI Hardware
Intel Reportedly Revives Older CPU Generations to Boost Affordable DDR4 PC Builds
·944 words·5 mins
Intel
PC Hardware
Processors
DDR4
DDR5
Desktop PCs
Motherboards
Comet Lake
Raptor Lake
MSI Claw 8 EX AI+ Hands-On: Intel Arc G3 Extreme Powers a New Generation of Windows Gaming Handhelds
·885 words·5 mins
Intel
MSI
Arc G3 Extreme
Gaming Handheld
Panther Lake
Computex 2026
Windows Gaming
Thunderbolt 4
Hardware Review
Why Optical Module MCUs Are Becoming Critical for AI Data Centers
·1583 words·8 mins
MCU
Optical Module
AI Data Center
Embedded Systems
Semiconductor
Optical Communication
CPO
Silicon Photonics
Morgan Stanley: AMD EPYC Venice to Outship NVIDIA Vera in 2027
·707 words·4 mins
AMD
NVIDIA
Tsmc
EPYC Venice
Vera CPU
AI
CoWoS
Server CPUs
Intel Nova Lake-S Leak: 52-Core Desktop CPUs, Z990 Platform, and 474W PL2 Explained
·1262 words·6 mins
Intel
Nova Lake
Desktop CPUs
Z990
PC Hardware
Semiconductors
CPU Architecture
Motherboards
Hygon Unveils 128-Core C86 CPU and Full-Stack Data Center Platform
·965 words·5 mins
Hygon
Server-Cpu
Data Center
AI Infrastructure
High-Performance Computing
PCIe 5.0
Networking
Cloud Computing
IBM's 0.7nm Nanostack Chip Breaks the Sub-1nm Barrier
·1108 words·6 mins
IBM
0.7nm
Semiconductors
Nanostack
AI Chips
EUV Lithography
CMOS
Quantum Computing
Intel 18A-P Explained: Performance, Thermals, and the Road to 2027
·1449 words·7 mins
Intel
Intel Foundry
18A-P
Semiconductor
Chip Manufacturing
RibbonFET
PowerVia
Data Center
Process Technology
VLSI 2026
TSMC and Intel Accelerate Advanced Packaging as Market Tops $8.1 Billion
·1266 words·6 mins
Tsmc
Intel
Advanced Packaging
Semiconductor
Glass Substrate
FOPLP
AI Chips
HPC
Chiplets
Manufacturing