Hardwares
2026
Huawei Tau Scaling V2 Explained: Is the Semiconductor Industry Entering the Tau Era?
·1414 words·7 mins
Huawei
Tau Scaling
Semiconductors
LogicFolding
3D IC
AI Chips
Chip Design
HiSilicon
Post-Moore Era
Advanced Packaging
Samsung and SK hynix Delay Hybrid Bonding for HBM4 as Memory Roadmaps Shift
·793 words·4 mins
HBM4
HBM4E
HBM5E
Samsung
SK Hynix
Hybrid Bonding
Semiconductor
Memory
AI Hardware
JEDEC
Apple Expands Foundry Strategy with Intel 18A-P While Keeping A20 on TSMC 2nm
·842 words·4 mins
Apple
Intel
Tsmc
18A-P
Semiconductor
Foundry
A20
Chip Manufacturing
Silicon
Technology
xLight vs. ASML: Can Free-Electron Lasers Redefine EUV Lithography?
·1291 words·7 mins
Semiconductors
EUV Lithography
ASML
XLight
Pat Gelsinger
Chip Manufacturing
AI Chips
Photonics
Huawei's Tau Scaling Theory V2 Introduces an Engineering Roadmap Beyond Moore's Law
·1174 words·6 mins
Huawei
Semiconductors
Moore's Law
Chip Design
Electronic Systems
AI Hardware
System Architecture
Research
Intel Nova Lake-S Leaks Reveal New 18-Core CPUs With Massive bLLC Cache
·1132 words·6 mins
Intel
Nova Lake-S
Core Ultra
Desktop CPUs
PC Hardware
Gaming
Processors
Semiconductors
AMD Raises Radeon GPU Bundle Prices by 10% Amid Rising GPU and VRAM Costs
·960 words·5 mins
AMD
Radeon
Graphics Cards
GPU
RDNA 4
PC Hardware
VRAM
AIB Partners
DDR5 Breaks 12,000 MT/s: G.Skill MasterDimm AC Brings Active RAM Cooling
·1035 words·5 mins
DDR5
Memory
PC Hardware
Overclocking
G.Skill
Cooler Master
Intel
AMD
AMD Versal Premium Gen 2 MoP: 32GB LPDDR5X, Memory-on-Package, and a 15-Year Lifecycle
·1264 words·6 mins
AMD
Versal
Adaptive SoC
FPGA
LPDDR5X
Memory on Package
Embedded Systems
Industrial Computing
PCIe 6.0
CXL
AMD Zen 6 Roadmap: Ultra-Low Power Cores, 2nm CPUs, and Memory-on-Package
·1231 words·6 mins
AMD
Zen 6
CPU
Semiconductor
Tsmc
Threadripper
Ryzen
Embedded Systems
AI Hardware